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| WSF256K8-XCX 256Kx8 SRAM/ FLASH MODULE FIG. 1 PIN CONFIGURATION TOP VIEW A18 A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 VSS ADVANCED* FEATURES s Access Times of 35ns (SRAM) and 70ns (FLASH) s JEDEC Standard, Hermetic Ceramic Package, 32 pin DIP (Package 300) s 256Kx8 SRAM s 256Kx8 5V FLASH s Memory Map Flash Memory: 0H-3FFFFH SRAM: 40000H-7FFFFH s Low Power CMOS s Commercial, Industrial and Military Temperature Ranges s TTL Compatible Inputs and Outputs s Built-in Decoupling Caps and Multiple Ground Pins for Low Noise Operation 11 MIXED MODULES 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VCC WE A17 A14 A13 A8 A9 A11 OE A10 CS I/O7 I/O6 I/O5 I/O4 I/O3 FLASH MEMORY FEATURES PIN DESCRIPTION A0-18 I/O0-7 CS OE WE VCC VSS Address Inputs Data Input/Output Chip Select Output Enable Write Enable +5.0V Power Ground s 10,000 Erase/Program Cycles s Sector Architecture * 8 equal size sectors of 16KBytes each * Any combination of sectors can be concurrently erased. Also supports full chip erase s Data Retention, 10 Years at 125C s 5 Volt Programming; 5V 10% Supply s Embedded Erase and Program Algorithms s Hardware and Software Write Protection s Page Program Operation and Internal Program Control Time * This data sheet describes a product that may or may not be under development and is subject to change or cancellation without notice. BLOCK DIAGRAM A0-16 I/O0-7 WE OE 128K x 8 Flash 128K x 8 Flash 128K x 8 SRAM 128K x 8 SRAM A17 A18 CS Decoder January 1996 1 White Microelectronics * Phoenix, AZ * (602) 437-1520 WSF256K8-XCX PACKAGE 300: 32 PIN, CERAMIC DIP, SINGLE CAVITY SIDE BRAZED 11 MIXED MODULES 42.4 (1.670) 0.4 (0.016) 15.04 (0.592) 0.3 (0.012) 4.34 (0.171) 0.79 (0.031) PIN 1 IDENTIFIER 3.2 (0.125) MIN 0.84 (0.033) 0.4 (0.014) 2.5 (0.100) TYP 1.27 (0.050) 0.1 (0.005) 0.46 (0.018) 0.05 (0.002) 0.25 (0.010) 0.05 (0.002) 15.25 (0.600) 0.25 (0.010) ALL LINEAR DIMENSIONS ARE MILLIMETERS AND PARENTHETICALLY IN INCHES ORDERING INFORMATION W S F 256K8 - XXX C X X LEAD FINISH: Blank = Gold plated leads A = Solder dip leads DEVICE GRADE: M = Military Screened I = Industrial C = Commercial -55C to +125C -40C to +85C 0C to +70C PACKAGE TYPE: C = 32 DIP (Package 300) ACCESS TIME (ns) 37 = 35ns SRAM and 70ns FLASH 72 = 70ns SRAM and 120ns FLASH also available ORGANIZATION, 256K x 8 Flash PROM SRAM WHITE MICROELECTRONICS White Microelectronics * Phoenix, AZ * (602) 437-1520 2 |
Price & Availability of WSF256K8-XCX
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